Overview Deep Learning improves yields in PCBA manufacturing by making sure each component is placed and soldered correctly. The flexibility of the Snap Platform makes implementing a turn key solution fast and painless to match the pace of PCBA innovation.
Currently AOI machines are expensive and difficult to program and use inflexible rules based algorithms.
The Overview Solution
Our Deep Learning platform enables lower cost and faster inspections. The Snap Platform allows full traceability with our cataloger feature and remote monitoring from anywhere.
How does the
Deep Learning Work?
Deep learning based alignment model makes the integration easier
Full board analysis on the solder mask looks for scratches or bubbles
Region-of-interest by region-of-interest inspection for component presence and correctness
Defects identified include bent pins, solder bridging, tombstoning, broken traces, etc
Consistent, reliable, 100% coverage inspection
Demo the Snap Platform to see how we improve your factory efficiency